Project: GRISU

Abstract:

Radiation damages to electronic components are an important issue for future FAIR experiments. One of the preferred technology for ASIC developments at GSI is the 180nm UMC CMOS process. In this regard the ASIC design group of the GSI Experiment Electronic department has been launched a research project in 2007, including the development of an ASIC called GRISU. The main goal is the characterisation of Single Event Effects (SEE) as well as Total Ionising Dose (TID) effects on the 180nm UMC process.

Documents:

coming soon...

Papers:

• CBM Progress Report 2008 - Radiation Studies on the UMC 180nm CMOS Process
• RADECS 2009 - Poster and Proceedings
• GSI Scientific Report 2009 - Single Event Effect Studies on the 180 nm UMC process with the GSI Heavy Ion Microprobe
• GSI Scientific Report 2009 - Radiation Studies on the UMC 180 nm CMOS Process
• CBM Progress Report 2009 - Single Event Effect Studies on the 180 nm UMC process with the GSI Heavy Ion Microprobe

Talks:

Internal EE group meeting talks:

• 23.04.2007: Project presentation "GRISU"
• 14.01.2008: GRISU, Measurements and Results
• 19.05.2008: GRISU status report SEU measurements
• 07.07.2008: GRISU status report
• 09.02.2009: GRISU status report
• 29.06.2009: Microbeam Bestrahlung GRISU
• 06.06.2011: GRISU Projekt

GSI IT/EE palaver:

• 20.01.2009: Untersuchung von Strahlungseffekten in anwendungsspezifischen integrierten Schaltungen (ASIC)

CBM meeting talks:

• 05.12.2008: UMC 0.18μm radiation hardness studies, CBM-XYTER Family Planning Workshop, GSI Darmstadt
• 12.03.2009: UMC 0.18μm radiation hardness studies - Update, 13th CBM Collaboration Meeting, GSI Darmstadt
• 07.10.2009: UMC 0.18μm radiation hardness studies, 14th CBM Collaboration Meeting, Split, Croatia
• 13.04.2010: UMC 0.18μm radiation hardness studies - Progress since last Collaboration Meeting, 15th CBM Collaboration Meeting, GSI Darmstadt
• 25.01.2012: Radiation studies and tests at GSI, CBM FEE/DAQ/FLES Workshop, Mannheim

Other meetings / talks:

• 18.03.2010: Untersuchung von Strahlungseffekten des UMC 180nm CMOS Prozesses an der GSI, DPG Frühjahrstagung 2010, Bonn
• 20.01.2011: Rad-Hard Electronics – Failure-Classes – ASIC, Beam Diagnostics R&D, GSI
• 05.05.2011: Radiation Damages to Electronic Components - Strahlungsschädigungen an elektronischen Bauteilen, SD Gruppenseminar, GSI
• 21.03.2012: Radiation Tolerance of Electronics, MC PAD Network Training Event, GSI

Timetable of project:

• Feb 2007: Submission of GRISU test ASIC
• Jun 2007: First tests of GRISU chip
• Oct 2007: First test beam at X6 (functional test with C-12)
• Jan 2008: Submission of GRISU2 test ASIC
• Feb 2008: Test beam with Ni-58 at X6 (11.4 MeV/AMU)
• Apr 2008: Test beam with C-12 at X6 (11.4 MeV/AMU)
• Mai 2008: Testing of GRISU2 chip
• Jul 2008: Test beam with Xe-132 at X6 (11.4 MeV/AMU)
• Jul 2008: Test beam with C-12 at X6 (11.4 MeV/AMU)
• Jul 2008: TID test with X-rays at FZ Karlsruhe (60 keV X-rays)
• Sep 2008: Annealing test
• Jan 2009: Test beam with Ar-40 at X6 (11.4 MeV/AMU)
• Mar 2009: Test beam with Ru-96 at X6 (11.4 MeV/AMU)
• Mai 2009: First microbeam test with Xe-132 at X0 (4.8 MeV/AMU) (Electrical test, software test, low statistic)
• Feb 2010: Heavy Ion Microprobe test with Au-196 at X0 (data for statistic)

plans:

• Low dose TID tests
• Triple redundant testing
• Neutron tests
• Proton tests at COSY (end of July 2012)
  • Beam diagnostic: Possible beam diagnostic device
  • Beam intensity: Possible ionization chamber for COSY 2012

-- SvenLoechner - 14 May 2012